Because of Qualcomm’s Snapdragon 8 Gen 1‘s thermal difficulties, the chipmaker is expected to make significant improvements with the Snapdragon 8 Gen 2. According to a recent Snapdragon 8 Gen 2 leak, Qualcomm is taking an experimental approach to CPU cluster configuration.
The SM8550 chipset, codenamed Kailua and thought to be the Snapdragon 8 Gen 2, has been spotted on Weibo by tipster Digital Chat Station. The chip will contain a 4nm TSMC design with an Adreno 740 GPU, according to the source. This indicates the 8 Gen 2 will be more efficient than the 8 Gen 1, as TSMC’s node has repeatedly demonstrated in comparison to Samsung’s node.
The Snapdragon 8 Gen 2 will feature a four-tier CPU design, with one Cortex-X3 core, two Cortex-A720 cores, two Cortex-A710 cores, and three Cortex-A510 cores, according to the leak. This indicates that the chip would have a 1+2+2+3 CPU design, confirming Qualcomm’s decision to abandon the triple-tier CPU layout (1+3+4) used since Snapdragon 855 in 2019.
While two of the cores have yet to be published, the Cortex-A710 is an older generation core that the tipster believes was employed to keep 32-bit functionality. This is due to the fact that not all developers have abandoned support for 32-bit apps, which means that even if Qualcomm utilises an all-64-bit cluster setup, not all apps will be compatible. As a result, it may be forced to utilise cores from previous generations.
Qualcomm recently announced a collaboration with AMD to optimise the Qualcomm FastConnect connectivity system for AMD Ryzen processor-based computing platforms, beginning with AMD Ryzen PRO 6000 Series CPUs and the Qualcomm FastConnect 6900 system.
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